IC Substrate for Gold Wire Bonding
Layer 2L
Material Rogers 4003
Size 64.5 x 53.5 mm
Thickness 0.5 mm
detail

Substrate for Gold Wire Bonding
Layer 2L
Material Mitsubishi Material
Size 240 x 70 mm
Thickness 0.3 mm
detail

Substrate for Gold Wire Bonding
Layer 2L
Material Mitsubishi Material
Size 109 x 109 mm
Thickness 0.1mm
detail

Substrate for Gold Wire Bonding
Layer 2L
Material FR4
Size 187 x 50 mm
Thickness 0.2 mm
detail

Substrate for Gold Wire Bonding
Layer 2L
Material Risho Material (Similar BT Material)
Size 109 x 109 mm
Thickness 0.17mm
detail